EU and Japanese Semiconductor Equipment Escapes US Tariffs as American Peers Take Bigger Market Hit

As of April 6, 2025, semiconductor equipment imported from the European Union (EU) is exempt from the recently imposed U.S. tariffs.The executive order issued by President Donald Trump specifies that certain goods, including semiconductors and semiconductor equipment, are not subject to the 10% baseline tariff or the additional 20% tariff on EU imports.

Since the April 2, 2025 tariff announcement, ASML’s stock fell about 9.5%, showing more resilience than the Philadelphia Semiconductor Index (SOX), which dropped approximately 16.7% (deepest point).

This exemption is significant for companies like ASML, the Dutch manufacturer specializing in the most advanced semiconductor lithography equipment needed to run all semiconductor fabs. Despite the broader tariffs, ASML's products remain unaffected, allowing U.S. semiconductor manufacturers to continue accessing essential machinery without additional costs.

Following the U.S. tariff announcement on April 2, 2025, several semiconductor equipment companies experienced notable stock declines:​

• Applied Materials (U.S.): Stock fell from $147.75 on April 2 to $126.95 on April 4, a 14.1% decrease. ​

• Lam Research (U.S.): Shares dropped from $73.78 on April 2 to $59.09 on April 4, a 19.9% decline. 

• KLA Corporation (U.S.): Stock decreased from $686.19 on April 2 to $576.53 on April 4, a 16% drop. 

• Tokyo Electron (Japan): Shares declined from ¥20,640 on April 2 to ¥18,960 on April 4, an 8.1% decrease. ​

• ASM International (Netherlands): Stock fell from €449.87 on April 2 to €412.60 on April 4, an 8.3% drop. 

These declines reflect market reactions to the tariff announcement, with US-based companies experiencing more significant percentage drops compared to their international counterparts.

Sources:

Understanding the New Tariffs | Market Intel | American Farm Bureau Federation

Tariffs Won’t Stop Companies Buying ASML’s Machines—Heard on the Street

BALD Engineering - Semiconductor & Strategic Tech Weekly Summary

Tariffs, Trade & Supply Chain Disruptions

Despite the US exempting semiconductors from new tariffs, chip stocks plunged, dragging the Nasdaq Composite into a deeper correction—now down over 20% since December. Major players like Marvell, ON Semiconductor, Broadcom, and Microchip posted double-digit losses, while Nvidia and Micron also fell sharply, erasing much of their recent gains. The Philadelphia Semiconductor Index (SOX) dropped 7.6% in a single day, marking its lowest point since November 2023.

Adding to the pressure, China retaliated with a sweeping 34% tariff on all US imports, while concerns mount over broader supply chain disruptions.

Tariff Reality Check: The Taiwan Dependency

While most semiconductors are manufactured in Taiwan, relocating chip production to the US offers limited tariff relief. Even if chips are fabricated in the US, they often must return to Taiwan for testing and packaging, stages still dominated by Taiwanese subcontractors.

From Semiconductor supply chain by Calus Aasholm, subscribe to his blog here: https://lnkd.in/d2ZXMHjw

Claus Aasholm points out that, even if test and assembly were moved, final packaged chips are still sent back to Taiwan to be integrated into devices like phones, PCs, and servers. Moreover, the bulk of materials used across the value chain still come from outside the US.

Given these realities, and in light of unpredictable tariff policies, manufacturing outside the US currently remains more cost-effective and reliable. Notably, the Taiwan-specific tariffs could hurt US firms the most, as Taiwan leads in semiconductor design and in key product segments like PCs, servers, and smartphones.

Apple, heavily dependent on Southeast Asia for production, also declined 7.3%. Sub-equipment providers like MKS Instruments and Advanced Energy suffered proportionally steep losses before markets closed for the weekend.

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Technology Leadership & Industry Momentum - Ångström Era Has Arrived

At its Vision 2025 conference, Intel announced that its 18A (1.8nm) process node has officially entered risk production, marking a major milestone in its “five nodes in four years” roadmap set to reclaim tech leadership from TSMC. According to Intel’s Kevin O’Buckley, 18A will be the first node to feature RibbonFET gate-all-around transistors and PowerVia backside power delivery.

Intel is also progressing toward its 14A node, leveraging High-NA EUV lithography, representing a leap in scaling capability.

In parallel, Intel is bringing high-volume 3nm chip production to Europe in 2025 through Fab 34 in Leixlip, Ireland. This facility will support Xeon 6 server chips and expand Intel Foundry Services’ offerings in Europe—part of Intel’s push to localize and diversify its global footprint.

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Critical Materials, Tariffs & European Innovation

Looking ahead, the Critical Materials Council (CMC2025) summit kicks off next week in Austin, Texas, at a moment of intensified scrutiny on material dependencies. On April 2, the US imposed 10–50% tariffs on a broad array of semiconductor-enabling materials, many of which the US is a net importer of. The list includes:

1️⃣ Specialty Gases and Etchants

• Neon [Ne], Krypton [Kr], Xenon [Xe]

• Nitrogen trifluoride [NF₃], Hexafluorodisilane [Si₂F₆]

• Sulfur hexafluoride [SF₆], Carbon tetrafluoride [CF₄], Octafluorocyclobutane [C₄F₈], Trifluoromethane [CHF₃]

• Fluorinated silanes, Ultra-pure hydrogen [H₂]

2️⃣ High-Purity Metals and Elements

• Gallium [Ga], Indium [In], Germanium [Ge]

• Tantalum [Ta], Niobium [Nb], Hafnium [Hf], …

3️⃣ Rare Earth Elements (REEs)

• Yttrium [Y], Terbium [Tb], Dysprosium [Dy]

• Neodymium [Nd], Lanthanum [La], Cerium [Ce]

• Praseodymium [Pr], Samarium [Sm], Europium [Eu], Gadolinium [Gd], Scandium [Sc]

4️⃣ Semiconductor Substrates and Wafers

• Monocrystalline silicon wafers (300mm), Silicon-on-insulator wafers [SOI]

• Silicon carbide [SiC], Sapphire [Al₂O₃], Gallium nitride [GaN], Gallium arsenide [GaAs], Indium phosphide [InP]

5️⃣ Photoresists and Lithography Materials

• EUV photoresists, Chemically amplified resists (CARs)

• KrF and ArF excimer laser gas blends

6️⃣ CMP and Wet Process Materials

• Colloidal ceria, High-purity alumina slurries, High-purity silica [SiO₂]

• Advanced CMP slurries and pads, Rare-earth-based slurries

7️⃣ CVD/ALD Precursors

• Trimethylaluminum [TMA], Tetrakis(ethylmethylamino)hafnium [TEMAH], Titanium tetrachloride [TiCl₄]

• High-purity silanes [SiH₄, TEOS], Organometallic precursors for metal gates and high-k dielectrics

Gadolinium: A Strategic Blind Spot

A glaring vulnerability emerged: gadolinium, a rare earth essential for over 30 million MRI scans annually, is almost entirely sourced and refined in China. Prices have risen over 50% since 2017, and any disruption would heavily impact GE Healthcare, Bayer, Bracco, and Guerbet—all of whom rely on it for MRI contrast agents. Yet, it remains overlooked in US trade strategies.

Swedish Tech start up GREEN14 Breakthrough in Sustainable Recovery

In Switzerland last week, GREEN14 partnered with Oerlikon for a successful testing program using DC plasma equipment to validate its multi-material hydrogen plasma process. The company demonstrated the recovery of:

✅ Copper from copper sulfide

✅ Titanium from titanium dioxide

✅ Tungsten from tungsten oxide

✅ Aluminium from aluminium oxide

This progress confirms the scalability of GREEN14’s clean tech process, unlocking new sustainable pathways to critical raw materials beyond silicon. It supports Europe’s push toward resilience, emissions reduction, and strategic material independence.

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SemiWiki CEO Interview with Jonas Sundqvist of AlixLabs

In a recent interview with Daniel Nenni, Jonas Sundqvist, CEO and co-founder of AlixLabs, discussed the company’s pioneering role as the world’s only pure-play Atomic Layer Etch (ALE) equipment provider. Drawing on his academic background in ALD and CVD from Uppsala University, Sundqvist explained how AlixLabs’ APS (ALE Pitch Splitting) technology enables atomic-scale precision in semiconductor patterning. APS helps chipmakers reduce process complexity, lower costs by up to 40% per mask layer, and improve yield, particularly in advanced logic and memory manufacturing. As the industry pushes toward sub-10 nm nodes, APS offers a scalable and sustainable alternative to traditional multi-patterning and EUV lithography.

Sundqvist emphasized that AlixLabs addresses critical pain points in semiconductor production, such as increasing lithography costs, complexity, and sustainability concerns. By minimizing energy use, reducing fluorinated gas emissions, and improving process efficiency, APS supports a greener and more cost-effective manufacturing path. AlixLabs differentiates itself from giants like ASML and proponents of self-aligned multi-patterning by offering a complementary technology that simplifies patterning. The company is currently collaborating with major chipmakers and research institutes, preparing a Beta tool for pilot testing by late 2025 and targeting high-volume manufacturing between 2027 and 2029.

Sources:

CEO Interview with Jonas Sundqvist of AlixLabs - SemiWiki

EU Business Hub | Semicon Japan 2024 Business Mission - Introducing AlixLabs AB

Introducing AlixLabs AB (Sweden): one of our selected companies to participate on the EU Business Hub at Semicon Japan 2024. 

During the recent EU Business Hub at Semicon Japan 2024 business mission that took place between the 9th and 13th of December, we witnessed the spark of global collaboration in action. European and Japanese companies participating in the mission shared their impressions – and their feedback reveals exciting opportunities on the horizon. 

The EU Business Hub at Semicon Japan 2024 mission stood out for its comprehensive approach to supporting European businesses seeking to enter the Japanese market: 

Tailored B2B Matchmaking: European companies had the chance to meet with key Japanese industry players through personalized B2B meetings, fostering future partnerships.

Market Intelligence & Local Expertise: Participants received valuable market insights and coaching on business culture, provided by the programme team, helping them navigate the Japanese market with ease.

Cultural & Linguistic Support: Expert interpreters and briefings on Japanese business culture ensured that each interaction was smooth and effective.

EU-Branded Pavilion: A platform for European companies at Semicon Japan 2024, showcasing cutting-edge solutions and elevating visibility among global tech leaders.

3rd and Last Call for Papers, and List of Speakers / Symposium on ALD & ALE Applications #21, at 248th ECS Fall Meeting / Oct. 12-16, 2025 in Chicago, USA

This fall, the 248th ECS Meeting will be held on Oct. 12-16, 2025 in Chicago (IL, USA), and is expected to gather some 3,000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

• General information and the Meeting Program can be found here: Important Information and Call for Papers.
• For more information about our annual symposium G01 and the conference website: Meeting Information. 

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 21” encourage you to submit your abstract(s) on topics, comprising but not limited to: 

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials; 

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.; 3. Interconnects and contacts: integration of ALD films with Cu and low-k materials; 

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory; 

5. New precursors, delivery systems & sustainability issues; 

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence 

7. Coating of nanoporous materials by ALD; 

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD; 

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.; 

10. ALD for energy storage applications; 

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll and spatial processing; 

12. Area-selective ALD; 

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc. 

FYI: Last year at the PRiME 2024 Meeting in Honolulu, our symposium G01 on ALD & ALE Applications 20 attracted some 80 participants, attending a full 3-days schedule with 50 presentations (42 oral, of which 16 invited, plus 8 poster presentations). We expect to be at least as successful this Fall in Chicago. 

Abstract submission 

Meeting abstracts should be submitted not later than the deadline of March 28, 2025 via the ECS website: Submission Instructions

Submission Instructions Invited speakers A list of invited speakers follows below: 

Visa and travel For extensive information, see last year’s version: VISA AND TRAVEL INFORMATION

In addition, ECS’ Francesca Di Palo (francesca.dipalo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society. For (limited) general travel grant questions, please contact travelgrant@electrochem.org. 

As in the past years, we expect also our symposium to be able provide some partial travel allowance to selected speakers. We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 21, in Chicago | Oct. 12-16, 2025!

Bridging the Lab-to-Fab Gap: Overcoming ALD Scaling Challenges with Chipmetrics, Finland

Scaling Atomic Layer Deposition (ALD) from laboratory research to high-volume semiconductor manufacturing presents numerous challenges, particularly as the industry moves towards more complex 3D structures like 3D NAND, Through-Silicon Vias (TSVs), and nanosheet transistors. One major hurdle is the disparity between lab-scale process development and industrial fabrication, where variations in chamber design and wafer size can lead to unexpected process deviations. Additionally, throughput and cost considerations play a critical role, as slow deposition rates can hinder industrial adoption due to high operating expenses. Defect control is another key concern, as even minuscule particle contamination can significantly impact yield, yet many research facilities lack the advanced defect detection capabilities necessary for high-volume manufacturing. Furthermore, test structure availability is a limiting factor, with sub-100 nm, high-aspect-ratio structures often restricted to leading semiconductor manufacturers, creating barriers for process validation and qualification.

Chipmetrics' PillarHall® metrology chips offer an innovative solution to these challenges by providing dedicated test structures with aspect ratios up to 10,000:1, allowing for rapid and cost-effective ALD validation without the need for complex cross-sectional analysis. These metrology chips facilitate the development of high-aspect-ratio thin film depositions by enabling researchers and manufacturers to evaluate process performance in a scalable manner, ensuring compatibility with industrial requirements. Beyond technical validation, the ability to conduct precise, non-destructive measurements enhances efficiency and reduces development costs, accelerating the transition from lab to fab. As semiconductor manufacturing continues to evolve, tools like PillarHall play a crucial role in streamlining the process transfer while maintaining the precision and reliability demanded by the industry.

PillarHall LHAR4 Test Chip in animated presentation. How to use the PillarHall chip in characterizing 3D thin film process conformality. Lateral High Aspect Ratio, Ultra High Aspect Ratio, Thin Film, Conformal, Deposition, Atomic Layer Processing, Atomic Layer Deposition, Chemical Vapor Deposition, ALD, CVD, HAR, 3D, metrology, Atomic Layer Etching, ALE

In this insightful presentation given by the inventor of PillarHall test chips, Professor Riikka Puurunen from the School of Chemical Engineering, Department of Chemical and Metallurgical Engineering at Aalto University, talks about "Recent Progress in Analysis of the Conformality of Film by Atomic Layer Deposition.

Source:

Challenges of Transferring Deposition Processes to Industry Partners in the Semiconductor Industry - Chipmetrics

ALD FOR INDUSTRY 2025: Advancing Atomic Layer Deposition from Science to Industrial Applications in Dresden

The 8th International Conference "ALD for Industry" took place in Dresden from March 11 to 12, 2025, bringing together experts to discuss advancements in Atomic Layer Deposition (ALD) technology. In addition to the previously mentioned presentations, the conference featured several notable talks:

Prof. Fred Roozeboom

AlixLabs and Aether Semiconductor

Silicon Austria Labs

ASM International

The handshake

Prof. Riikka Puurunen

"Fundamentals of Atomic Layer Deposition: A Tutorial" by Prof. Riikka Puurunen

Prof. Riikka Puurunen from Aalto University, Finland, delivered a comprehensive tutorial on the fundamentals of ALD. She covered the history of ALD, its underlying surface chemistry, typical reaction mechanisms, and growth modes. Prof. Puurunen also discussed the role of diffusion in 3D structures and provided insights into surface reaction kinetics.

​In her tutorial titled "Fundamentals of Atomic Layer Deposition," Prof. Riikka Puurunen of Aalto University provided a comprehensive overview of ALD, a nanotechnology technique for precise surface modifications and thin coatings. She traced ALD's dual origins: Atomic Layer Epitaxy (ALE) developed by Tuomo Suntola in 1974, and Molecular Layering (ML) introduced by Valentin Aleskovskii and Stanislav Koltsov in the 1960s. The tutorial delved into the core principles of ALD, emphasizing its reliance on repeated, self-terminating reactions between gaseous reactants and surfaces. Prof. Puurunen categorized typical reaction mechanisms, discussed factors influencing saturation and growth modes, and highlighted "growth per cycle" (GPC) as a fundamental characteristic of ALD processes. She also explored the role of diffusion in complex 3D structures, noting how diffusion-limited growth can provide insights into surface reaction kinetics. The presentation available at Fundamentals of ALD: tutorial, at ALD for Industry, Dresden, by Puurunen 2025-03-11 | PPT

"Spatial ALD of IrO₂ and Pt Films for Green H₂ Production by PEM Electrolysis" by Dr. Paul Poodt

Dr. Paul Poodt, Chief Technology Officer at SparkNano, presented on the application of spatial ALD in fabricating iridium dioxide (IrO₂) and platinum (Pt) films. These materials are crucial for enhancing the efficiency of proton exchange membrane (PEM) electrolyzers used in green hydrogen production. Dr. Poodt highlighted how spatial ALD enables precise control over film thickness and composition, leading to improved performance and durability of electrolyzer components.

SparkNano’s CTO, Paul Poodt, presented on Spatial ALD of IrO₂ and Pt Films for Green H₂ Production by PEM Electrolysis on March 12 at 10:20 AM during the Emerging Applications session. Attendees had the opportunity to connect with him to discuss SparkNano’s spatial ALD technology.

"Advancements in ALD for Next-Generation Semiconductor Devices" by Dr. Christoph Hossbach

Dr. Christoph Hossbach from Applied Materials / Picosun Europe discussed recent progress in applying ALD techniques to next-generation semiconductor devices. His presentation covered the integration of ALD processes in manufacturing advanced transistors and memory devices, emphasizing the role of ALD in achieving atomic-scale precision and conformality required for modern microelectronics. 

"ALD Applications in Quantum Technology" by Dr. Martin Knaut

Dr. Martin Knaut of TU Dresden explored the utilization of ALD in developing components for quantum technologies. He highlighted how ALD's ability to deposit uniform and defect-free thin films is essential for fabricating qubits and other quantum devices, potentially leading to more stable and scalable quantum computing systems. 

"Emerging Applications of ALD in the Medical Field" by Dr. Mira Baraket

Dr. Mira Baraket from Atlant 3D presented on the potential of ALD in medical applications, including the development of biocompatible coatings for implants and drug delivery systems. She discussed how ALD can enhance the performance and safety of medical devices by providing precise control over surface properties.

Sources:

ALD for Industry 2025 – EFDS

AlixLabs Demonstrates 3 nanometers on Intel Silicon – Without EUV

The Swedish semiconductor company has fabricated leading-edge structures without using complex and costly lithography techniques.

The Swedish semiconductor company AlixLabs announces that it has used its technology to etch structures equivalent to commercial 3-nanometer circuits on Intel test silicon. Notably, this has been achieved without the use of extreme ultraviolet lithography (EUV) or advanced multi-patterning techniques such as SADP and SAQP (Self-Aligned Double Patterning and Self-Aligned Quad Patterning, respectively).

AlixLabs, a startup based in Lund, specializes in the development of Atomic Layer Etching (ALE), a type of plasma-based dry etching for cutting-edge structures, and ALE Pitch Splitting (APS), which enables transistor fins to be split using etching. The advantage of this approach is that it significantly reduces costs at the cutting edge, where wafer prices skyrocket with each new generation.

"We are pleased to demonstrate how APS can help the industry reduce its dependence on multi-patterning while lowering costs and environmental impact. Our technology enables the fabrication of sub-10-nanometer structures on silicon, and through Intel’s Test Vehicle Program, we have proven that sub-5-nanometer structures can be achieved using etching alone."

– Dmitry Suyatin, CTO and Co-Founder of AlixLabs

According to Dmitry Suyatin, AlixLabs’ CTO, this demonstration was made possible through Intel’s Test Vehicle Program, which provided test silicon for AlixLabs to process with its APS technology. While ALE has traditionally been limited to structures in the 10-nanometer class, AlixLabs' APS technique has significantly simplified the manufacturing of structures smaller than 5 nanometers.

Etching 3-nanometer-class structures without advanced EUV lithography, using only immersion lithography, is a significant breakthrough—provided the technology can be scaled and applied in practical manufacturing. AlixLabs has previously stated its goal of seeing its technology adopted by TSMC and Samsung for their 2-nanometer processes.

Since the industry moved past the 28-nanometer node, multi-patterning has become increasingly necessary to create smaller structures and transistors. This lithographic technique involves breaking down complex patterns into simpler ones and sequentially patterning them onto the silicon wafer for higher precision and detail. Lithography can perform this in two, three, or four steps (SADP, SAQP), though more steps are theoretically possible, they are considered too complex and costly for practical use at smaller nodes.

"APS technology demonstrates that complex multi-patterning techniques such as SADP and SAQP are not needed to manufacture circuits at 5 nanometers and below. This increases the potential to use immersion lithography for critical mask layers in 3-nanometer processes. These results were achieved with our early Alpha equipment, and Beta equipment will follow later in 2025. We thank Intel for enabling this demonstration and providing high-quality test silicon."

– Jonas Sundqvist, CEO and Co-Founder of AlixLabs

While lithographic multi-patterning is often necessary, it comes with several downsides. Each additional step requires more masks, which must be precisely aligned to form the final, complex pattern. Even a slight misalignment can lower yield and performance, but more importantly, it significantly extends production time. Avoiding multi-patterning whenever possible is therefore always preferable.

It is essential to distinguish between "nanometer-class" structures and actual physical nanometer measurements. What AlixLabs has achieved is a metal pitch (the distance between metal interconnects connecting transistor gates) of 25 nanometers through dry etching. This compares to TSMC’s most advanced 3-nanometer process, which achieves a metal pitch as low as 23 nanometers in certain high-density configurations.

AlixLabs highlights this test silicon as a major milestone towards commercialization and announces that more updates will follow later in 2025. Additional details will be presented by CTO Dmitry Suyatin at SPIE Advanced Lithography + Patterning in San Jose, California, on February 27, from 9:00–9:20 AM (local time).

Sources:

AlixLabs demonsterar 3 nanometer på Intel-kisel – utan EUV – Semi14

AlixLabs to Showcase Latest APS™ Findings at SPIE Advanced Lithography + Patterning – AlixLabs

Browse the 2025 program for SPIE Advanced Lithography + Patterning

JSR Expands Global Semiconductor Material Capabilities with New Photoresist Facilities, Advanced MOR Variants, and Strategic Acquisition of CVD/ALD Precursor Firm

JSR Corporation is expanding its global development and production of advanced photoresists by establishing a new R&D center in Japan and constructing a semiconductor photoresist plant in Korea. Since acquiring Inpria Corporation in 2021, JSR has been commercializing Metal Oxide Resist (MOR) for EUV lithography. The new R&D center in Japan’s Kanto region will enhance collaboration with global customers and partners, while the Korean plant, expected to begin operations in 2026, will handle the final production process for MOR to support local adoption. JSR aims to drive innovation in photoresists and help customers establish commercial production processes worldwide.

JSR's MOR, developed through its 2021 acquisition of Inpria Corporation, is a next-generation photoresist designed for EUV lithography. MOR is based on metal oxide nanoparticles, offering superior etch resistance and improved pattern resolution compared to traditional chemically amplified resists (CARs). This allows for finer feature definition and reduced line-edge roughness, critical for advanced semiconductor manufacturing below 10 nm. JSR has been scaling MOR for commercial adoption, with major semiconductor manufacturers evaluating its use in high-volume production. The company is expanding its R&D and manufacturing capacity, including a new R&D center in Japan and a production facility in Korea, to support global adoption of MOR.

JSR have investigated different flavors of MOR for EUV lithography, primarily focusing on variations in metal cores and process optimizations. Initially, zirconium (Zr) and hafnium (Hf) based MORs were explored, but their relatively low EUV absorption led researchers to investigate alternative metal cores such as titanium (Ti), zinc (Zn), indium (In), and tin (Sn). These new metal cores exhibited improved lithographic performance, achieving higher EUV absorption, smaller particle size, and better scum reduction. Additionally, process optimizations such as using higher dissolution rate photoacid generators (PAGs), new organic solvent developers, and lower soft bake temperatures were tested to improve scum removal and resolution. The new metal core variants demonstrated resolutions down to 13 nm with reduced defects, suggesting their potential for advanced semiconductor manufacturing.

In August 2024, JSR Corporation completed the acquisition of Yamanaka Hutech Corporation (YHC), a Kyoto-based manufacturer specializing in high-purity chemicals for semiconductor manufacturing. This strategic move allows JSR to expand its product portfolio to include Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) precursors, which are essential for forming advanced and complex semiconductor device structures. YHC, established in 1960, has over 60 years of experience in advanced molecular design, synthesis technology, and quality control systems, supplying high-quality CVD/ALD precursors to leading-edge semiconductor device manufacturers. The acquisition aligns with JSR's strategy to strengthen its position as a global supplier of semiconductor materials, enhancing its capabilities in both miniaturization and device structure innovation.

Sources:

JSR Expands Global Development and Production Functions for Leading-Edge Photoresists | 2024 | News | JSR Corporation

tec125-4.pdf

High-Precision ALD and Etching Techniques Enable Sub-1nm EOT in Monolayer MoS₂ Transistors

Researchers from Stanford University and Yonsei University have investigated the role of silicon seed layers in enabling high-quality atomic layer deposition (ALD) of HfO₂ on monolayer MoS₂, achieving sub-nanometer equivalent oxide thickness (EOT) and precise threshold voltage control.

Researchers developed a method to achieve sub-1 nm equivalent oxide thickness (EOT) in monolayer MoS2 transistors using atomic layer deposition (ALD) of HfO2 with a silicon seed layer, enabling improved threshold voltage control and low hysteresis. They investigated six seed layer candidates (Si, Ge, Hf, La, Gd, Al2O3) and found that only Si and Ge preserved the integrity of MoS2. The Si seed provided the best interface, allowing for the fabrication of normally-off transistors with a well-behaved threshold voltage. The resulting devices demonstrated a low EOT of approximately 0.9 nm, minimal leakage current (<0.6 μA/cm²), and a subthreshold swing of ~80 mV/dec at room temperature. This method offers a simple and accessible approach to depositing high-quality top-gate dielectrics in common nanofabrication facilities.

The manufacturing process of monolayer MoS2 transistors in the study involves several key steps, including atomic layer deposition (ALD) and etching processes:

1. MoS2 Growth and Device Preparation: Monolayer MoS2 is synthesized using chemical vapor deposition (CVD) at 750°C on a SiO2 (90 nm) / p++ Si substrate. Alignment markers are deposited, and large contact pads (SiO2/Ti/Pd) are patterned and lifted off.

2. Channel Patterning and Etching: The transistor channels are defined via electron-beam lithography and etched using xenon difluoride (XeF2) chemistry. Gold source and drain contacts are then deposited using electron-beam evaporation.

3. Seed Layer Deposition: For the top-gate structure, ultrathin Si and Ge seed layers (~1 nm) are deposited using e-beam evaporation under high vacuum (~10⁻⁷ Torr). These seed layers are exposed to air before undergoing characterization via Raman and XPS measurements.

4. Atomic Layer Deposition (ALD) of HfO₂: The Si or Ge-seeded samples are placed in the ALD chamber at 200°C for 30 minutes before initiating the deposition process. HfO₂ is grown using tetrakis(dimethylamido)hafnium (TDMAH) and H₂O as precursors at 200°C. The ultrathin Si seed oxidizes into SiOx, forming a high-quality interface for dielectric growth.

5. Top-Gate Metallization and Etching: The Pd top gate is patterned and deposited using e-beam evaporation. To expose the contact pads for probing, the top-gate oxide is selectively removed using inductively coupled plasma (ICP) etching with CF₄.

6. Annealing: The top-gated devices undergo vacuum annealing at 150°C, while back-gated devices without top gates are annealed at 250°C for two hours to remove moisture and stabilize electrical characteristics.

This process enables the formation of high-quality MoS₂ transistors with sub-1 nm equivalent oxide thickness (EOT), low leakage, and precise threshold voltage control.

Sources:

Sub-Nanometer Equivalent Oxide Thickness and Threshold Voltage Control Enabled by Silicon Seed Layer on Monolayer MoS2 Transistors | Nano Letters

nl4c01775_si_001.pdf

Accuron Acquires Trymax to Strengthen Plasma Etch Equipment Portfolio and Expand Global Reach

Accuron Technologies has acquired a controlling interest in Trymax Semiconductor Equipment, a specialist in plasma-based and UV-based process equipment for semiconductor manufacturing. This acquisition strengthens Accuron’s presence in the semiconductor equipment sector and enhances its portfolio in the Etch & Clean process segment. Trymax, headquartered in the Netherlands, will continue to be led by its existing management team, ensuring continuity and execution of its expansion strategy. With Accuron’s resources and network, Trymax aims to accelerate its growth, broaden its customer base, and enhance product development. This move marks a strategic step for both companies, leveraging synergies to drive innovation and global expansion in semiconductor manufacturing solutions.

Sources:

Trymax joins Accuron Technologies group for further growth and expansion - Trymax Semiconductor

 

TU Eindhoven and LONGi Advance ALD ZnO Passivating Contacts, Achieving 24.3 Percent Efficiency in Silicon Solar Cells

Atomic layer deposition of ZnO for contact passivation in silicon solar cells has emerged as a promising alternative to TOPCon technology, with the recent breakthrough of zinc oxide passivating contacts achieving 24.3 percent efficiency in a LONGi solar cell. This development builds on research led by Bart Macco’s group at Eindhoven University of Technology, which pioneered the concept of ZnO passivating contacts. The breakthrough was further demonstrated by LONGi, which successfully integrated the technology into high-efficiency solar cells.

Key advancements include the use of an interfacial SiO2 layer for passivation, Al2O3 capping to retain hydrogen during annealing, and selective Al2O3 removal to enable electrical contact while preserving passivation. The integration of a low-work-function LiF layer has improved contact resistivity, reducing the need for heavy silicon doping.

ALD ZnO offers lower-temperature processing, thinner layers around five nanometers, and elimination of toxic dopants compared to doped poly-Si in TOPCon. With potential advantages in scalability, industrial feasibility, and initial efficiency gains, ZOPCon could surpass TOPCon, though further research is needed to enable bifacial designs, optimize lateral conductivity, and enhance stability for large-scale production.

Sources

Passivating Contacts for Silicon Solar Cells: A Zinc Oxide Breakthrough? – Atomic Limits

Jusung Engineering Records Strong Financial Performance and Expands ALD Equipment Shipments in 2024

Jusung Engineering Ltd. (KOSDAQ:036930) maintains a strong financial position with a net cash balance of ₩187.2 billion, as its cash reserves of ₩232.2 billion significantly exceed its ₩45.0 billion in debt. Despite total liabilities exceeding cash and receivables by ₩109.4 billion, the company's market capitalization of ₩1.37 trillion suggests that these obligations do not pose a substantial risk. Jusung Engineering's EBIT grew by an impressive 211% over the past year, further strengthening its ability to manage debt. Additionally, with free cash flow amounting to 80% of EBIT over the last three years, the company demonstrates solid cash flow management, reducing concerns over its debt burden. Given these factors, Jusung Engineering appears financially stable, with strong earnings and liquidity to support future growth.

Jusung Engineering shipped atomic layer deposition equipment for DTC silicon capacitor production on the 17th of last month.

In May 2024, Jusung Engineering unveiled plans to restructure its business by spinning off its semiconductor, solar, and display divisions into separate entities. The strategic move aimed to enhance operational efficiency and create greater shareholder value. However, by October 2024, the company decided to cancel the spin-off due to opposition from shareholders. The total stock purchase price for the stocks exercised in opposition exceeded KRW 50 billion, leading to the decision to maintain the company's current structure.

Beyond its financial success, Jusung Engineering made notable advancements in its technology offerings. In November 2024, the company shipped Atomic Layer Deposition (ALD) equipment for the production of Deep Trench Capacitor (DTC) Silicon Capacitors to Elspeth. 

Jusung Engineering's strong financial results, strategic decisions, and technological advancements reinforce its position as a key player in the global semiconductor industry. 

References:

JUSUNG ENGINEERINGLtd (KOSDAQ:036930) Could Easily Take On More Debt - Simply Wall St News

https://www.mk.co.kr/en/business/11231493
https://www.businesskorea.co.kr/news/articleView.html?idxno=216376
https://www.marketscreener.com/quote/stock/JUSUNG-ENGINEERING-CO-LTD-6494704/news/JUSUNG-ENGINEERING-Co-Ltd-cancelled-the-Spin-Off-of-Semiconductor-equipment-research-and-developme-48189649/
https://www.mk.co.kr/en/business/11164246

Forge Nano Expands ALD Capabilities with New TEPHRA™ Cluster Tool and State-of-the-Art Cleanroom

Forge Nano has significantly expanded its semiconductor atomic layer deposition (ALD) capabilities with the completion of a new 2,000 sq ft cleanroom dedicated to manufacturing its TEPHRA™ ALD cluster tools. This expansion comes in response to increased demand for high-throughput ALD solutions in the 200mm wafer market, particularly for advanced packaging, power semiconductor, and microelectromechanical system (MEMS) applications. The new facility, featuring Class 10 (ISO 4) cleanroom space and a dedicated metrology lab, will enable Forge Nano to accelerate production, conduct customer demonstrations, and validate ALD process integration for commercial-scale adoption.

The TEPHRA™ cluster tool is designed to deliver ultrathin, uniform coatings with 10x the throughput of traditional ALD systems, supporting applications such as conformal metal barrier seed layers for through-silicon and through-glass vias (TSVs and TGVs). With customer tool deliveries expected in early 2025, Forge Nano is inviting industry partners to on-site demonstrations showcasing TEPHRA’s capabilities. This expansion reinforces Forge Nano’s position as a key enabler of next-generation semiconductor manufacturing, offering efficient and scalable ALD solutions for the growing demand in advanced node technologies.

Sources:

Blog - Forge Nano

Lam Research’s Dry Resist: A Breakthrough in EUV Lithography for Next-Generation Logic and Memory Manufacturing

Lam Research’s dry resist technology represents a major shift in EUV lithography and semiconductor patterning, addressing critical challenges such as stochastic defectivity, resolution limitations, and cost-efficiency. With recent qualifications for advanced DRAM and 2nm logic manufacturing, along with a growing ecosystem for high-volume production, dry resist is positioned to disrupt traditional chemically amplified resists (CARs) and enable future High-NA EUV adoption.

One of the most significant recent developments is Lam’s qualification of dry resist for 28nm pitch BEOL logic at 2nm and below in collaboration with imec. This qualification confirms that dry resist can eliminate multi-patterning steps, reducing complexity and improving EUV throughput. The process is designed to work with both low-NA and high-NA EUV scanners, ensuring its relevance for sub-2nm logic scaling. This represents a key milestone in extending direct EUV printing to future logic nodes, an approach that could significantly lower lithography costs while improving pattern fidelity.

In addition, a leading DRAM manufacturer has selected Lam’s Aether dry resist technology as its production tool of record for advanced DRAM nodes. This decision highlights dry resist’s low-defect, high-fidelity patterning capabilities, which are essential for scaling memory architectures. The technology enables lower exposure doses while reducing stochastic defects, which are a major concern in EUV-based DRAM production. Given that Samsung, SK Hynix, and Micron are all increasing their reliance on EUV for next-generation DRAM, Lam’s dry resist is well-positioned for widespread adoption in the memory sector.

To ensure a stable supply chain for dry resist materials, Lam Research has partnered with Entegris and Gelest, a Mitsubishi Chemical Group company. This collaboration ensures reliable dual-source precursor production, providing chipmakers with long-term process stability. The partnership also focuses on the development of next-generation high-NA EUV precursors, further strengthening dry resist’s role in future sub-2nm manufacturing.

SEM images of 28 nm pitch line/space patterns imaged with 0.33NA EUV in dry resist from Entegris precursor.

A critical enabler of dry resist technology is its atomic layer deposition (ALD) process, which replaces traditional spin-coating used in CARs. ALD-based vapor-phase deposition offers higher uniformity, eliminating polymer chain variations found in conventional resists. It also allows precise thickness control, which is essential for optimizing EUV photon absorption and etch selectivity. Unlike CARs, which rely on a complex mixture of polymers, dry resist materials are based on single-component metal-organic precursors such as organo-tin oxides. These materials provide higher EUV photon absorption, improving sensitivity and pattern resolution.

Another key advantage of dry resist is its anisotropic dry development process, which replaces wet solvent-based development. Traditional CAR-based EUV resists require organic solvents or aqueous bases, leading to stochastic defects, material loss, and waste. Dry resist, by contrast, is developed entirely in the gas phase, selectively removing unexposed regions and forming a negative-tone image. This eliminates line collapse and delamination issues, improving yield stability. Additionally, the elimination of wet chemistries significantly reduces chemical waste, making dry resist a more sustainable solution with five to ten times lower material consumption compared to traditional resists.

Lam’s dry resist technology is poised to disrupt traditional CAR-based EUV lithography, particularly as the industry moves toward High-NA EUV adoption. By reducing multi-patterning dependency, the technology enhances cost-effective EUV scaling, making it an attractive solution for both logic and memory manufacturers. This positions Lam as a key leader in next-generation EUV resist solutions, challenging conventional resist suppliers like JSR, TOK, and Inpria.

From a sustainability perspective, dry resist significantly lowers EUV exposure dose requirements, leading to higher scanner throughput and lower energy consumption. Its reduced defectivity translates to higher yield per wafer, further enhancing cost-efficiency. The collaboration with Entegris and Gelest ensures supply-chain stability, making dry resist a viable and scalable technology for sub-2nm nodes.

The patent US20220020584A1 mentions several Lam Research tools that play a role in the dry resist deposition, patterning, and development process for EUV lithography. The Altus system is referenced for deposition, likely for metal or dielectric films in the dry resist stack, while the Striker plasma-enhanced atomic layer deposition (PEALD) system may be used for precise resist or underlayer deposition. The Versys platform, known for plasma processing, is relevant to the dry development process, and the Syndion system, typically used for deep silicon etching, may have applications in pattern transfer. Additionally, the Reliant tool is designed for volume manufacturing, possibly adapted for integrating dry resist technology, and the Kiyo plasma etch system is likely involved in etching after the dry resist development stage. These tools collectively enable Lam’s dry resist process to achieve improved resolution, defect reduction, and cost efficiency in advanced EUV lithography.

The patent US20220020584A1, filed by Lam Research Corporation, describes an innovative dry development process for EUV photoresists, which eliminates the need for traditional wet chemical development methods. The patent details a dry resist system deposited via vapor-phase precursors, forming a highly uniform, single-component material that enhances EUV photon absorption and sensitivity. The dry development process selectively removes unexposed resist regions using plasma-based or plasma-free chemical methods, significantly reducing line collapse and defectivity while improving resolution at sub-2nm nodes. By integrating dry resist deposition, EUV exposure, and dry development into a single cluster tool, the patented technology enables scalable, high-volume EUV manufacturing with lower chemical consumption and improved process sustainability, positioning it as a key enabler for High-NA EUV lithography.

Lam Research’s dry resist technology represents a significant development in EUV lithography by addressing key challenges in stochastic defectivity, process cost, and sustainability. Its qualification for 2nm logic and advanced DRAM manufacturing confirms its readiness for high-volume production. By utilizing ALD for precise resist deposition and securing a stable precursor supply through partnerships with Entegris and Gelest, Lam has established a strong foundation for scaling the technology. 

Sources:

Lam Research Press Release on DRAM Adoption (Jan 2025): Lam Research

imec Qualification of Dry Resist for 2nm Logic (Jan 2025): imec

Entegris and Gelest Collaboration Announcement (July 2022): Entegris

Overview of Dry Resist ALD and Precursor Chemistry: SemiAnalysis

ASML High-NA EUV Roadmap and Implications for Dry Resist: ASML

Lam Reserach patent application US20220020584A1: US20220020584A1.pdf

Revolutionizing Silicon Photonics: First Electrically Pumped Group IV Laser Achieved for Seamless Integration on Silicon Chips

Researchers have achieved a groundbreaking milestone in silicon photonics by developing the first electrically pumped Group IV laser, made from silicon-germanium-tin layers directly grown on silicon wafers. This innovation paves the way for cost-effective, energy-efficient photonic integrated circuits in next-gen silicon chips.

The breakthrough in silicon photonics achieved by an international research team marks a transformative step in the materials and manufacturability of photonic devices. By developing the first electrically pumped continuous-wave laser made entirely of Group IV materials—silicon, germanium, and tin—the researchers overcame a long-standing challenge in integrating efficient light sources directly into silicon-based technologies. This laser is built using ultrathin layers of silicon-germanium-tin and germanium-tin, grown directly on silicon wafers. Its compatibility with conventional CMOS processes promises seamless integration into existing silicon manufacturing workflows, reducing costs and enhancing scalability. Unlike traditional lasers based on III-V materials, which are costly and complex to integrate with silicon, this innovation makes use of widely available Group IV elements, providing an energy-efficient and manufacturable solution for on-chip photonics.

This laser not only operates with a low current of 5 milliamperes at 2 volts but also features a sophisticated multi-quantum well structure and ring geometry to minimize power consumption and heat generation. Though the device currently functions at cryogenic temperatures, its development path mirrors earlier advancements in germanium-tin lasers that achieved room-temperature operation within a few years. The laser’s manufacturability is further underscored by its growth on standard silicon wafers, aligning with industry-standard processes. This achievement is poised to catalyze the adoption of low-cost photonic integrated circuits (PICs) in microchips, meeting the growing demand for energy-efficient hardware in AI and IoT applications while paving the way for advances in optical data transmission and next-generation silicon photonics.

Sources:

Silicon Photonics Breakthrough: The “Last Missing Piece” Now a Reality

3D Vertical Ferroelectric Capacitors for Memory Scaling

3D vertical ferroelectric capacitors are revolutionizing memory technology, offering higher density and performance by leveraging vertical structures to overcome planar scaling limits. Using aluminum-doped hafnium oxide (Al:HfO₂), these capacitors achieve stable remnant charge, low voltage operation, and enhanced scalability, addressing advanced applications in AI and edge computing. Recent innovations, such as the TiN/Al:HfO₂/TiN configuration introduced by Dongguk University, South Korea, demonstrate improvements in endurance and integration. This progress builds on foundational work by Qimonda and Fraunhofer IPMS-CNT in Dresden Germany, including Tim Böscke's pioneering discovery of ferroelectricity in hafnium oxide and Johannes Müller's ALD advancements using ALD process developments FHR and ASM tools. These developments cement Al:HfO₂ as a DRAM and CMOS-compatible solution for next-generation non-volatile memory technologies.

3D vertical ferroelectric capacitors are transforming memory technology by providing higher density and performance in compact designs. Leveraging a vertical structure, they overcome planar scaling limits by using the third dimension to maximize storage capacity. Incorporating ferroelectric materials like aluminum-doped hafnium oxide (Al:HfO₂) enables these capacitors to achieve spontaneous polarization and stable remnant charge even at reduced dimensions. With features like low voltage, high-speed operation, and improved retention and endurance, they address critical challenges in advanced memory while remaining compatible with CMOS processes, facilitating their integration into existing manufacturing technologies. This innovation is key to meeting the demands of data-intensive applications such as AI and edge computing.

A recent study, 3D Vertical Ferroelectric Capacitors with Excellent Scalability (by Eunjin Lim et al Dongguk University, South Korea)), introduces a 3D vertical ferroelectric capacitor with a TiN/Al:HfO₂/TiN configuration. It employs a unique architecture with multiple small holes sharing a common pillar electrode, enhancing ferroelectric properties and scalability. Analyses using advanced microscopy confirm its structural integrity, while the device demonstrates high endurance, minimal variability, and excellent retention. This architecture also supports integration into one-transistor n-capacitor ferroelectric memory with vertical transistors.

Importantly, Earlier work by Fraunhofer IPMS-CNT, including the 2012 study Incipient Ferroelectricity in Al-Doped HfO₂ Thin Films, first demonstrated ferroelectric properties in HfO₂ thin films doped with aluminum. This research identified an antiferroelectric-to-ferroelectric phase transition, influenced by Al concentration and annealing conditions, and attributed ferroelectricity to a non-centrosymmetric orthorhombic phase (Pbc2₁). This foundational work highlighted the potential of Al:HfO₂ for applications in memory and sensing technologies.

The later paper High Endurance Strategies for Hafnium Oxide-Based Ferroelectric Field Effect Transistors further emphasized Al:HfO₂’s scalability and compatibility with CMOS technology. It explored strategies to improve endurance and reduce interfacial stress, including modifying interfacial materials and exploring MFS structures. These strategies balance performance, reliability, and scalability, supporting the broader adoption of ferroelectric memory.

In Johannes Müller's PhD thesis (2014, Fraunhofer IPMS-CNT), the Atomic Layer Deposition (ALD) processes for hafnium oxide (HfO₂) and aluminum-doped hafnium oxide (Al:HfO₂) utilized advanced deposition equipment to achieve precise doping and phase control. The processes were performed using a 300 mm FHR ALD 300 and an ASM PULSAR 3000®, both of which are designed for high-uniformity deposition on large substrates, such as 300 mm wafers. These tools facilitated the use of tetrakis(ethylmethylamino)hafnium (TEMAHf) and trimethylaluminum (TMA) as precursors for hafnium and aluminum, respectively, along with oxidants like water or ozone. By tailoring precursor ratios, deposition temperatures, and annealing conditions, the processes ensured the stabilization of the orthorhombic Pbc2₁ phase, critical for the ferroelectric properties of Al:HfO₂ films. These advancements highlight the scalability and compatibility of ALD-fabricated Al:HfO₂ films with CMOS technology.

Semiconductor Cleanroom Tools: Introducing ASM Eagle XP4 for ALD | Fraunhofer IPMS

Historic picture of the FHR ALD 300 mm tool, at the previous location of Fraunhofer IPMS-CNT. The FHR cluster was co-developed by Qimonda and Fraunhofer CNT and teh original discovery of ferroelectric hafnium oxide was by Qimonda and a PhD Student from TU Dresden, Tim Böscke. His groundbreaking work, published in 2011, demonstrated the ferroelectric properties of silicon-doped hafnium oxide (Si:HfO₂), marking a major milestone in the development of CMOS-compatible ferroelectric materials. This discovery laid the foundation for integrating ferroelectric properties into hafnium oxide-based systems, revolutionizing non-volatile memory technologies

The patent US 2009/0057737 A1, authored by Tim Böscke et al., describes a method for fabricating integrated circuits with a dielectric layer that exhibits enhanced properties, such as high dielectric constants and ferroelectricity. The process involves forming a preliminary dielectric layer, such as hafnium oxide or doped hafnium oxide (e.g., aluminum- or silicon-doped), using techniques like Atomic Layer Deposition (ALD). The dielectric layer is initially amorphous and undergoes a phase transition to a crystalline state upon heating above its crystallization temperature. The method includes precise doping of the dielectric layer to stabilize desirable phases, such as orthorhombic or tetragonal, which are essential for achieving ferroelectricity. A covering layer, often a conductive electrode material, is deposited before annealing to assist in crystallization and enhance material properties. The innovations outlined aim to improve memory applications, such as capacitors and transistors, by offering higher storage densities, lower leakage currents, and compatibility with advanced CMOS processes. This patent is foundational in the development of ferroelectric hafnium oxide-based technologies.

Sources:

• 3D Vertical Ferroelectric Capacitors with Excellent Scalability: 3D Vertical Ferroelectric Capacitors with Excellent Scalability | Nano Letters
• Mueller, S., et al., Incipient Ferroelectricity in Al‐Doped HfO₂ Thin Films, Advanced Functional Materials, 2012. Wiley Online Library
• High Endurance Strategies for Hafnium Oxide-Based Ferroelectric Field Effect Transistor, Fraunhofer IPMS, 2016. (N-432037.pdf): N-432037.pdf
  Ferroelektrizität in Hafniumdioxid und deren Anwendung in nicht-flüchtigen Halbleiterspeichern Ferroelektrizität in Hafniumdioxid und deren Anwendung in nicht-flüchtigen Halbleiterspeichern
• US 2009/0057737A1 (prev. QIMONDA AG, now NAMLAB GGMBH) https://patentimages.storage.googleapis.com/56/02/b2/d476f4848ffe82/US20090057737A1.pdf